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  • 產品應用2016-04-15

    產品應用

    Product Application Field (產品應用領域)Optotronic Die Bond paste ( LED Lighting , Back Light Unit (BLU), LED Indicator,Numeric Display, Photo /Opto Coupler,Remote Control module..光電封裝用固晶接著劑(銀膠,透明絕緣膠,高導熱銀膠)IC Packaging Die Bond Paste (SO/TO/TSOP/LQFP/QFN, WBG etc…