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產品應用

產品應用領域

日期 :2018/07/21

Product Application Field (產品應用領域)


Optotronic Die Bond paste ( LED Lighting , Back Light Unit (BLU), LED Indicator,Numeric Display, Photo /Opto Coupler,Remote Control module..

光電封裝用固晶接著劑(銀膠,透明絕緣膠,高導熱銀膠)


IC Packaging Die Bond Paste (SO/TO/TSOP/LQFP/QFN, WBG etc).

半導體封裝用固晶膠(導電銀膠,絕緣膠,高散熱膠)


Memory Card ( Pen drive, SD Card,Micro SD Card)..

各式記憶卡封裝固晶膠


MEMS Application( Cavity paste, Ceramic Oscillator Package)..

微機電封裝膠(微型MIC,陶瓷振盪器,光感測器)


CMOS/CCD Sensor (Lens Holder, Glass sealing, Die bonding)..

鏡片貼合,固晶膠及各式接著劑


Photonic Devices ( TO/ Back Filled holder/ Photonic Diode)..

光通訊產品系列之固晶膠材


Relay (Conductive paste)

繼電器構裝膠材


Touch Panel (ITO Bonding paste)..

觸控面版用導電銀膠,雷射銀膠,細線銀膠


Frit Bonding Paste for Candle light 

高溫燒結型印刷線路銀膠


Potting Paste ( Glop top).

透明封裝膠


UV Curable Adhesives 

UV光固化膠/UV+濕氣固化膠材/ UV+厭氧膠材系列


UV Resin for Protective Tape

保護膠帶用UV 樹脂


DCC Epoxy for Hard Disk. HDD 

硬碟構裝用特殊膠


Dipping conductive pastes for Passive components

被動元件之端銀膠及填充絕緣膠


Silicone based conductive paste for Oscillator

矽導電銀膠


Microwave Absorber & Foam 

微波通訊用遮蔽材料


Conformal Coating paste 

功能性/結構塗料


ACF/ACA Paste

異方式導電膠材