Optoelectronic Module

MENU
Optoelectronic Module
A high-performance polymer adhesive developed specifically for LED and various optoelectronic components. It includes insulating adhesives featuring high adhesion, snap curing, excellent heat resistance, and UV resistance. In combination with highly conductive and flexible conductive adhesives, these are widely used for fixing and conducting precise components such as LED modules, backlight units, and light sensors.
Conductive silver adhesive
Product Application Resin
type		 Viscosity
cp		 TI. Thermal
Conductivity
W/m．K		 Volume
resistance
Ω-cm		 Curing
conditions
min/°C		 TDS
FP-5100F • Low viscosity
• Excellent high-temperature adhesion
• LED Chip、SMD
• Lamp (straight insertion)/Zener diode 		Epoxy
resin 		8000 5.8 2.5 0.0005 60/150
FP-5100FA 8200 5.2 3.1 0.0001
FP-5100-E4 9500 5.4 3.5 30/175
60/160
FP-5100-E4B 11000 5.7 60/160
FP-5100-E10 13000 5.5
Snap curing conductive adhesive
Product Application Resin
type		 Viscosity
cp		 TI. Thermal
Conductivity
W/m．K		 Volume
resistance
Ω-cm		 Curing
conditions
min/°C		 TDS
FP-1725-SC1 Suitable for rapid hardening process Epoxy
resin 		15000 3.5 2 <0.001 0.5/200
FP-1725-B3-5 8000 5.0 1.8 2/175
5/150
FP-1725-E4 • High temperature fast curing application
• IC, LED, VCM low temperature bonding 		4.5 0.0005 60/80
10/100
FP-1725-TE4 • Low temperature hardening
• High temperature snap curing
• Small semiconductor chips, LED chips
• Can be used in automatic jetting machines 		12000 3.5 2.6 <0.0005 90/80
30/100
Heat/UV resistant Insulating adhesive
Product Application Resin
type		 Filling
Type		 Viscosity
cp		 TI. Thermal
Conductivity
W/m．K		 Curing
conditions
min/°C		 TDS
EP-3600-A8-1 • High TI. value
• For LED medium and low power die bonding 		Epoxy
resin 		Si 16000 4.8 0.23 120/150
EP-3600-H2 • Optoelectronic components die bonding
• Anti-yellowing, colloid is not easy to collapse 		24000 1.5 -- 60/160
EP-3600-W2-3 • LED medium and high power
• Thermal bonding of semiconductor IC
• LED backlight source die bonding 		BN 27000 3.8 0.7
EP-3600-WL2 • Low temperature curing
• High thermal conductivity
• High power LED thermal bonding 		BN
Al2O3 		33000 2.5 2 90/110
20/150
EP-1600-SL1 • Chip LED, GaN LED chip Si 16500 -- 40/160
EP-3600-A8-2 22000 3.5 60/160