We specialize in advanced adhesive chemistry, focusing on thermal curing, UV curing, and high-performance encapsulation materials. Our expert team—rooted in materials science, polymer chemistry, and chemical engineering—combines deep theoretical knowledge with extensive application experience to meet the rigorous demands of the precision electronics industry.
1.Specialty Adhesives: Silicone, epoxy, acrylic, and hybrid systems.
2.Functional Capabilities: Insulating, thermally/electrically conductive, and toughening.
3.Curing Mechanisms: Thermal curing, quick-dry and long-bake conditions.
• Semiconductor packaging
• Optical communication components
• LED encapsulation
• Precision electronic assembly
We work closely with leading tech companies to co-develop cutting-edge materials tailored to evolving industry trends
High-Performance Formulation Design：Built for high temperature resistance, low stress, strong adhesion, and electrical stability
Customized Solutions：Designed to integrate seamlessly into your production
Advanced Testing & Analysis：State-of-the-art tools ensure performance and reliability
Eco-Friendly & Sustainable Development：Low-VOC, solvent-free, and eco-compliant materials
Our R&D focuses on next-gen materials with an emphasis on:
• Nanotechnology
• Smart functional coatings
• Harsh-environment resistance
• Low-carbon and energy-saving applications
We believe innovation is the catalyst for industrial evolution, and we’re committed to building a smarter, greener, and more efficient future through deep collaboration with academia and industry partners
