Semiconductor Applications

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Semiconductor Applications
Specifically designed for semiconductor packaging and chip bonding. The conductive adhesive features high thermal conductivity, low resistance, snap curing, and low volatility, suitable for chip attachment and lead frame packaging. The insulating adhesive supports B-stage dual-phase baking to meet the needs of multi-stage printing and chip bonding processes, ensuring packaging reliability and stability.
MEMS sensing element package
Product Type Characteristic Resin
type		 Viscosity
cp		 TI. Modulus
25°CMPa		 TDS
AP-1200-A1 Non-conductive • Low stress and low moisture absorption Acrylate
resin 		11500 4.2 919
EP-2015-3-Black • High reliability
• Good adhesion on different surfaces
BP-2000-SRB9 • Reflow soldering temperature range with
stable modulus 		Epoxy
resin 		24000 4.6 3.2
EP-2009-J6A Non-conductive
B-Stage 		• B-stageable wafer back coating, fillet control 50000 1.4 2342
EP-2101-8 • B-stageable BOC, fillet control 32000 2.3 161
FP-5300TC-20A Conductive • High thermal and electrical conductivity
• High mold shear strength 		10000 4.5 9058
FP-1725-B5 • High reliability
• Good adhesion on different surfaces 		2742
Conductive silver adhesive
Product Application Resin
type		 Viscosity
cp		 TI. Thermal
Conductivity
W/m．K		 Volume
resistance
Ω-cm		 Tg ℃ Curing
conditions
min/°C		 TDS
FP-1725-B4 • Rapid hardening process
• Lead frame encapsulation
• MSL L3-260℃ 		Epoxy
resin 		8500 4.5 2.5 <0.001 120 2/200
15/150
FP-5023 • Small chip bonding
• Lead frame encapsulation
• MSL L3-260℃ 		9000 4.8 3.1 0.0001 89 30min
ramp to 150°C
keep 60/150
FP-5023-A2 8500 3.9 2 0.0002 98
FP-7003 8000 5.4 2.5 0.0001 93 30min
ramp to 175°C
keep 60/175
FP-5023-E2 • Low stress
• Medium-sized chip bonding
• Lead frame encapsulation
• MSL L3-260℃ 		9500 3.5 2 0.0002 92 30min
ramp to 150°C
keep 60/150
FP-8000-P2 Acrylate
resin 		8500 4.5 0.005 48 30min
ramp to 175°C
keep 60/175
High thermal Conductive silver adhesive
Product Application Resin
type		 Viscosity
cp		 TI. Thermal
Cond.
W/m．K		 Volume
resis.
Ω-cm		 Tg ℃ Curing
conditions
min/°C		 TDS
FP-5200TC-2 • High thermal conductivity
• Small and medium-sized
chip bonding
• MSL L3-260℃ 		Epoxy
resin 		8500 4.5 10 0.0001 100 60/150
FP-5300TC-20A 9500 20 <0.0005 81 60/175
FP-5300TC-L3 • Low temperature curing
• Small and medium-sized
chip bonding 		5.5 120 60/130
FP-6000-HP3 • Semi-sintered
• High power thermal and
electrical conductive die bonding 		15000 7 100 6*10-5 127 60/130+90/200
FP-6100-HP9 • Fully sintered
• High thermal conductivity and
excellent electrical conductivity 		None 10000 6.5 140 6*10-6 -- Chip˂ 2*2mm :
60/110+90/200
Chip> 2*2mm :
90/110+120/200
FP-6100-HP240 • Fully sintered
• High thermal conductivity
• Semiconductor packaging 		4.5
︱
7.5 		240 6x10-6 Chip˂ 2*2mm:
60/110+90/200
Chip> 2*2mm:
90/110+120/200
Insulating adhesive
Product Application Resin
type		 Viscosity
cp		 TI. Thermal
Cond.
W/m．K		 Volume
resis.
Ω-cm		 Tg ℃ Curing
conditions
min/°C		 TDS
AP-1200-A2 • low stress
• Small and medium-sized
chip bonding
• PBGA and Array BGA s
• MSL L2-260℃ 		Epoxy
resin 		12000 4.5 0.2 -- 15 30 min
ramp to175°C
keep 60/175
EP-2005 • Small and medium-sized
chip bonding 		8500 5 0.28 1 x 1013 47 30 min
ramp to150°C
keep 60/150
EP-2015R • Small and medium-sized
chip bonding 		12000 3.1 0.25 127
EP-2009-J6A • B-Stage WBC insulating adhesive
• Steel plate and screen printing
• Resistant to warping after baking 		50000 1.4 -- -- 86 B-stage:
ramp to 30/25~100
keep 60/100
ramp to 30/100~25
C-stage:
30~60/175
CSP/BGA/SMT underfill Insulating adhesive
產品名稱 特性 Resin
type		 Color Viscosity
cp		 DMA 25℃ CTE Tg ℃ Curing
conditions
min/°C		 TDS
EP-30-UF1B • Hot plate or oven quick-set
• Excellent filling speed
• Longer working life 		Epoxy
resin 		Black 1500 2333 59/148 115 Hot plates
10/130
EP-30-UF3B • Snap curing at low temperatures
• Good bond strength 		1000 2083 48/206 110 20/135
EP-30-UF4B • Low coefficient of thermal expansion
• Low shrinkage
• High filler ratio 		110000 9703 24/75 67 120/100
60/150
EP-30-BF3 • Low temperature curing
• Solvent-free insulating adhesive
• Suitable for oven heating 		23500 6701 27/74 125 30/100
B-stageable insulating adhesive
Product Application Resin
type		 Color Type of
filler		 Viscosity
cp		 TI. Tg ℃ Curing
conditions
min/°C		 TDS
EP-2101-7A • B-stageable
• Printing process
• Chip bonding for different sizes 		Epoxy
resin 		yellow SiO2 31000 3.3 57 85/50+
60/150
Seals/LIDs Insulating adhesive
Product Application Type Resin
type		 Viscosity
cp		 TI. Tg ℃ Curing
conditions
min/°C		 TDS
EP-20-L04B • B-stageable two-stage curing
• Scribing or stencil printing
• Pressing, capping process
• Bonding LCP, PCB, glass, metal and
ceramic substrates 		Printing
Dispensing 		Epoxy
resin 		34000 4.0 82 B-stage
60/100
C-stage
30/175
EP-2009-6-H-117 Dispensing 33000 3.6 89 B-stage
40~60/80~100
C-stage
90~120/170~175
EP-20-L05B • One-stage curing
• Scribing or stencil printing
• Pressing, capping process
• Bonding LCP, PCB, glass, metal and
ceramic substrates 		Printing
Dispensing 		80000 3.25 113 30 /175
90 /150
EP-20-L06B 6.5 167