3C Applications

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3C Applications
Developed for the assembly of 3C electronic products, this polymer adhesive offers snap and low-temperature curing, flexibility, and protection. It effectively absorbs stress and enhances impact resistance of components. It also provides excellent adhesion to various substrate surfaces (such as metal, plastic, and glass), ensuring product durability and quality.
Low-temperature snap curing insulating adhesives
Product Application Resin
type		 Color Viscosity
cp		 TI. Tg ℃ Curing
conditions
min/°C		 TDS
EP-2006-SC5-6 • Snap curing
• IC, CMOS, CCD Die Bonding 		Epoxy
resin 		Red 10000 2 46 Hot plates
1.5/110
0.2/150
EP-2006-SC5-9 30000 5.5 -- 30/120
10/150
EP-13-LM28NB • Low temperature curing
• Camera module
• CCD/CMOS applications 		Black 11000 4.5 40 60/60
30/70
20/80
EP-M6791-1 • Low temperature curing
• Excellent flexibility
• Excellent adhesion to plastics, glass, metals
and ceramics 		9000 -- 13 30/70
20/80
10/90
EP-13-FL63 • Low temperature curing
• Suitable for PA and LCP substrate bonding
• Camera module and Lens attached 		Milky 1000 2 45 30min
ramp to 150°C
Keep 60/150