Conductive silver adhesive
| Product |
Application |
Resin
type |
Viscosity
cp |
TI. |
Thermal
Conductivity
W/m．K |
Volume
resistance
Ω-cm |
Curing
conditions
min/°C |
TDS |
|
FP-5100FA |
• Low viscosity
• Excellent high-temperature adhesion
• LED Chip、SMD
• Lamp (straight insertion)/Zener diode |
Epoxy
resin |
8200 |
5.2 |
3.1 |
0.0001 |
60/150 |
|
|
FP-5100-E4B |
11000 |
5.7 |
3.5 |
0.0005 |
60/160 |
|
|
FP-1725-B6 |
• Low temperature curing
• LED Chip Bonding
• Electronic components are fixed |
10000 |
5 |
2.6 |
0.0002 |
60/120 |
|
|
FP-5300TC-20A |
• High thermal conductivity applications
• Suitable for LEDs above 1W
• High-power die bonding |
95000 |
4.5 |
>20 |
<0.0005 |
60/175 |
|
|
FP-1725-E9 |
• Resilient
• IC, LED conductive adhesive |
15000 |
3.5 |
2.5 |
120/80
60/100 |
|
Filling, fixing, encapsulation
| Product |
Application |
Resin
type |
Viscosity
cp |
TI. |
Tg ℃ |
Hardness
Shore D |
Curing
conditions
min/°C |
TDS |
|
AP-2100-C1(A/B) |
• Tow-component
• High-temperature snap-curing type
• Excellent workability and reliability |
Epoxy
resin |
A: 4000
B: 2000 |
-- |
133 |
80 |
1/150
5/120
10/100
30/80 |
|
|
EP-30-BF2 |
• One-component
• High-temperature snap-curing type
• Excellent workability and reliability |
26000 |
1.35 |
127 |
93 |
60/100 |
|
UV/heat dual-curing adhesives
| Product |
Application |
Resin
type |
Viscosity
cp |
TI. |
Tg ℃ |
Hardness
Shore D |
Curing
conditions
min/°C |
TDS |
|
EP-28-3410-50K |
• One-component
• UV/thermal dual curing system
• Glass, PCB, PA, PEI
• Metal and ceramic seal bonding |
Epoxy
resin |
33400 |
1.85 |
150 |
90 |
wavelength
200~500nm
2,000~4,000 mj/cm2
+ Heat
60/100
45/110
30/120 |
|
