Silicone Applications
A silicone-based polymer adhesive specially designed for LED chip bonding, suitable for applications such as Chip LEDs, GaN LEDs, and LED lamps. It also supports pin transfer and dispensing processes. Featuring high purity, low volatility, high transparency, and excellent anti-yellowing properties, it enhances light-emitting efficiency and reliability of LED products.
Silicone Applications
Product Application Resin
type
Filling
Type
Viscosity
cp
TI. Thermal
Conductivity
W/m.K
Curing
conditions
min/°C
TDS
EP-1600-S3A • Medium and low power LEDs
• Blue and green chip bonding
silicon
Epoxy
resin
silicon 15000 1.8 0.22 120/150
EP-1600-SW1 • Medium and high power LEDs
• IC thermally conductive die bonding
BN 2 1 120/160
EP-6000-SH5 • Medium and low power LEDs
• Blue and green chip bonding
silicon silicon 11000 1.7 0.25 120/150
EP-6000-SHW5 • Medium and high power LEDs
• IC thermally conductive die bonding
BN
Al2O3
15000 3.7 0.8